Miihini Whakapiri Waea
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Semiconductor IC Taputapu Taputapu / Aluminium Wedge Bonding Machine GR-W01
Mo nga pākahiko hiko hiko hou, hurihanga photovoltaic, hikohiko motuka, rokiroki hiko, IGBT, BMS papa whakahaere haumaru pākahiko, aha atu;
Ka taea e tenei miihini hono waea te hototahi ki te konumohe me te hononga waea parahi;
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Miihini Waea Konumohe mo te Waea Waea To Series -Wedge Bonding ICs/GR-W02
He rarangi-kotahi ki te raupapa miihini hono waea motuhake；
Ko te GR-W02 he miihini hono waea e tika ana mo nga taputapu hiko, he hototahi te hua ki te rarangi kotahi ki te maha-rarangi ultrasonic kohinga me te hoahoa, ka whakamahia te kaapiri i muri i te maha o nga whakahou whakahou, ma te whakamahi i nga motika raina pumau me te pono, te reo coil nga motuka, nga punaha ultrasonic mo te hanga. I tua atu, ko te kaha o te mohio ki te tauira o te taputapu e whakarato ana i te hua me te pono ki te ahumahi.
