Miihini Whakapiri Waea
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Semiconductor IC Taputapu Taputapu / Aluminium Wedge Bonding Machine GR-W01
Mo nga pākahiko hiko hiko hou, hurihanga photovoltaic, hikohiko motuka, rokiroki hiko, IGBT, BMS papa whakahaere haumaru pākahiko, aha atu;
Ka taea e tenei miihini hono waea te hototahi ki te konumohe me te hononga waea parahi;
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Miihini Waea Konumohe mo te Waea Waea To Series -Wedge Bonding ICs/GR-W02
He rarangi-kotahi ki te raupapa miihini hono waea motuhake；
Ko te GR-W02 he miihini honohono waea e tika ana mo nga taputapu hiko, he hototahi te hua ki te rarangi kotahi ki te maha-rarangi ultrasonic packaging me te hoahoa, ka whakamahia te bonder i muri i te maha o nga whakahou whakahou, te whakamahi i nga motika raina e mau ana me te pono, nga miihini reo, nga punaha ultrasonic mo te whakaputa. I tua atu, ko te kaha o te mohio ki te tauira o te taputapu e whakarato ana i te hua me te pono ki te ahumahi.
