Semiconductor IC Taputapu Taputapu / Aluminium Wedge Bonding Machine GR-W01
Āhuahira Hua
●Whakauruhia nga waea matotoru me nga takai ki roto i te papa miihini kotahi me te whakarereke i nga punaha tere;
●Na roto i te mana tukanga fehokotaki'anga arai, ka taea te whakarite nga tawhā fehokotaki'anga i roto i te wā tūturu mo te mata rauemi huringa ki te whakarite te kounga fehokotaki'anga repeatable;
●Tukatuka i te maramatanga na roto i te tuitui maataki i runga i nga ture Ahumahi 4.0/OT;
●Achieve the best material match through a variety of ultrasonic frequency to choose from, and promote the stability of the process;
●Ko te whakauru o te hangarau tukanga me te automation mai i te puna kotahi o te tuku.
Tuhia to korero ki konei ka tukuna mai ki a matou