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Semiconductor IC Taputapu Taputapu / Aluminium Wedge Bonding Machine GR-W01

Mo nga pākahiko hiko hiko hou, hurihanga photovoltaic, hikohiko motuka, rokiroki hiko, IGBT, BMS papa whakahaere haumaru pākahiko, aha atu;

Ka taea e tenei miihini hono waea te hototahi ki te konumohe me te hononga waea parahi;


Taipitopito Hua

Tohu Hua

Āhuahira Hua

●Whakauruhia nga waea matotoru me nga takai ki roto i te papa miihini kotahi me te whakarereke i nga punaha tere;
●Na roto i te mana tukanga fehokotaki'anga arai, ka taea te whakarite nga tawhā fehokotaki'anga i roto i te wā tūturu mo te mata rauemi huringa ki te whakarite te kounga fehokotaki'anga repeatable;
●Tukatuka i te maramatanga na roto i te tuitui maataki i runga i nga ture Ahumahi 4.0/OT;
●Achieve the best material match through a variety of ultrasonic frequency to choose from, and promote the stability of the process;
●Ko te whakauru o te hangarau tukanga me te automation mai i te puna kotahi o te tuku.


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